Acid Copper Plating Process

Rectifier Capacity :

8 Volt - 250/500/750/1000/1500 Amps

Air/ Oil cooled , with deamer and digital meters

Additional facility : Timer, Chiller unit, Amp Totalizer, Dozing pump for Brighteners.

Air Agitation Pump :

Vacuum type blower @ Capacity of 0.5/1/2/3/5 HP with Air Filters

Water Cooled Air pump with Mechanical Seal @ Capacity of 1/2/5 HP

Tank :

Fabricated with MS and Rubber Lined/ PVC lined

Fabricated with PP with wall thickness of 10/12 mm

Additional facility : Air Agitation Coil, Anode-Cathode Brackets, Outside FRP lining.

Filter Pump :

125 LPM Magnetic Pump with PP Chamber @ 2500 LPH Actual Filtration Capacity

1 HP Mechanical Pump with MS Chamber @ 5000 LPH Actual Filtration Capacity

2 HP Mechanical Pump with MS Chamber @ 10000 LPH Actual Filtration Capacity

Cooling Coil :

Titanium Pipe @ Diameter from 0.5’ to 1.5’ with wall thickness 1.5 mm to 3 mm.

Anode Basket :

Titanium Basket with Solid Huck.

Operating Parameters :

Temperature : 20 to 30 ° C.
Voltage : 2 to 4 Volt DC.
Current : 30 to 60 Amps/ Sq. Ft.
Bath Composition : Copper Sulphate 200-220 gms/ltr
Sulphuric Acid : 35 – 45 ml/ltr.
Chloride : 90 - 140 ppm/ltr.
Carrier Brightener : 8 – 10 ml/ltr.
Leveller : 3- 4 ml/ltr.
Maint. Brightner : 0.5 – 2 ml/ltr.
Anodes : Phosphorised Copper Anode (0.3% Phosph.)
Rate of Deposition : 25 micron in 30 min @ 30 Amp/sq.ft.
Filtration : 2 hrs of working days.
Air Agitation : Vigorous and continue while process, Oil free Air should be employed.
Brightener maintenance : Carrier Brightener @ 0.1 % to 0.2% of bath volume.
Leveller @ 100 to 200 ml/ KAH
Maint. Brightener @ 350 to 450 ml/KAH